China’s SiCarrier is making strides in developing DUV lithography technology for 5nm chips, leveraging self-aligned quadruple patterning. The company is set to showcase new wafer fabrication products at SEMICON China, amidst efforts to advance homegrown semiconductor production and reduce reliance on Western technologies. Despite potential, commercialization hurdles persist, and competitive dynamics remain complex.

In an effort to reduce dependency on Western chipmaking technologies, China’s SiCarrier is reportedly advancing deep ultraviolet lithography (DUV) techniques for 5nm chip production. Sources such as Bloomberg and the South China Morning Post indicate that SiCarrier’s self-aligned quadruple patterning (SAQP) technology may play a crucial role in enabling this progress.

SiCarrier has garnered attention this year, particularly with its patent for producing 5nm chips using DUV tools, notably connected to Huawei’s 7nm chip in the Mate 60 Pro. The company plans to unveil several new products during SEMICON China this week, showcasing innovative wafer fabrication tools named after notable mountains.

The showcased tools include Emei mountain epitaxial products, Wuyi mountain etching systems, Changbai mountain chemical vapor deposition (CVD) equipment, Putuoshan physical vapor deposition (PVD) gear, and Alishan atomic layer deposition (ALD) tools. This unveiling marks a significant moment in the presence of SiCarrier alongside leading local semiconductor equipment firms, such as Naura.

SiCarrier’s quadruple patterning technology, patented recently, has the potential to enhance transistor density and performance by etching silicon wafers multiple times. This DUV lithography may allow SiCarrier to achieve 5nm capabilities independent of extreme ultraviolet (EUV) systems, which could result in reduced production costs.

However, there are differing views on the feasibility of SiCarrier’s technology. Reports from Nikkei suggest that while SiCarrier has built lithography machines for 28nm or older nodes, its commercialization remains uncertain, especially in a market dominated by firms like ASML, Nikon, and Canon.

Additionally, China is reportedly making strides in developing homegrown EUV lithography systems. A trial at Huawei’s Dongguan facility is underway, aiming for mass production by 2026. This new EUV system tests the laser-induced discharge plasma (LDP) technology, generating 13.5 nm radiation necessary for advanced lithography.

In conclusion, SiCarrier’s advancements in DUV lithography signify promising developments for China’s semiconductor production capabilities, potentially reducing reliance on Western technologies. The unveiling of innovative fabrication tools and the application of quadruple patterning technology highlight the ambitious plans to achieve 5nm chip production. However, ongoing uncertainties regarding commercialization and competition from established firms highlight the challenges ahead for SiCarrier. Furthermore, progress in homegrown EUV systems could further shape the landscape of China’s semiconductor sector in the coming years.

Original Source: www.trendforce.com

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