SiCarrier’s Innovative Solutions for China’s Advanced Semiconductor Needs

SiCarrier presented new semiconductor manufacturing technology at Semicon China, advocating for domestic tools to enable advanced chip production amid U.S. export restrictions. The company’s methods involve using multi-patterning as a workaround for lithography challenges, supporting China’s semiconductor goals and collaboration with major firms like SMIC and Huawei.

SiCarrier recently showcased a range of etching, deposition equipment, and optical metrology tools at the Semicon China industry fair. This significant event attracted approximately 1,400 exhibitors and highlighted SiCarrier’s potential to support China’s semiconductor ambitions amidst U.S. export restrictions.

According to Du Lijun, the president of Shenzhen SiCarrier Industry Machines, China is facing hurdles in accessing lithography systems necessary for advanced chip production. However, he suggested that domestic tools might serve as alternatives to enable the manufacture of 5-nanometer chips.

Du warned that implementing multi-patterning techniques could challenge yields as the process may increase manufacturing steps by around 20% when advancing from 7-nanometer to 5-nanometer technology. SiCarrier’s equipment is already utilized by prominent Chinese foundries, including Semiconductor Manufacturing International Corporation (SMIC), although SMIC did not provide an immediate comment.

Established in 2022, SiCarrier Industry Machines and its parent company, SiCarrier Technology, were founded with backing from a state-supported investment fund. Despite facing restrictions, SiCarrier aims to leverage multi-patterning technology, which utilizes deep ultraviolet lithography (DUV) to circumvent the need for advanced extreme ultraviolet (EUV) lithography tools from ASML. The company secured a patent for this technology in late 2023, signifying a step forward in its ability to produce cutting-edge chips at reduced costs.

In summary, SiCarrier is positioning itself as a key player in China’s semiconductor industry by offering domestic alternatives to high-end chipmaking technologies recently restricted by the U.S. By introducing multi-patterning techniques, it aims to facilitate the production of advanced 5-nanometer chips while addressing potential manufacturing challenges. The ongoing collaboration with significant entities such as SMIC and Huawei underscores its growing influence in the sector.

Original Source: manufacturing.economictimes.indiatimes.com